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Dia Resin Bond Die Grinding Whl
SKU 199533
3M(TM) Diamond Resin Bond Die Grinding Wheel 1A1, 4 in x 1/4 in x 1-1/4 in, X=1/4, D220 R100 B, 1 per case Diamond particles in a resin bond matrix offer high cut rates and good abrasive life in die grinding applications.
| Sold by WL (1/WL) | |||
|---|---|---|---|
| 1+ | 5+ | 10+ | 20+ |
| Retail price | 5% | 8% | 12% |
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